Current
I in amps, J in A/dm², A in dm².
100 cm² = 1 dm². 1 in² = 6.4516 cm².
Estimate electroplating current, plating time and conductive-coating voltage loss. Upload your 3D part or enter its surface area to plan a copper or other single-metal plating run.
Voltage results describe coating losses, not the total voltage to set on your power supply.
CAD area is an approximation. Internal, overlapping and sealed faces may be counted. Confirm scale, then set the exposed fraction for each file.
Count every wetted conductive face, including both sides. Include exposed hanging wire in the allowance below.
Optional two-stage estimate. Set the start from your bath/paint instructions; the example below is not an automatic recommendation.
With power disconnected, measure from the actual hanger contact to several surface locations. Probe contact affects the result; check remote areas separately.
A simplified single-path model, not a conductivity simulation. It cannot establish a safe current or predict coverage. Average conductivity is not multiplied into Faraday’s law.
Use your estimate to check your power supply and plan your setup. Then choose the kit or materials you need. The calculator stays free, whether you buy from us or not.
Read each product’s contents and required extras. Prefer us to do the plating? Explore our copper plating service.
Surface area sets the amps. Charge sets the deposit. Conductivity influences how evenly current can reach the surface.
I in amps, J in A/dm², A in dm².
100 cm² = 1 dm². 1 in² = 6.4516 cm².
Use cm² for A, cm for δ, g/cm³ for ρ, g/mol for M, seconds for t, and efficiency η as a fraction. 1 µm = 10⁻⁴ cm; F ≈ 96,485.332 C/mol. n is electrons per deposited atom.
σ in S/m, lengths L, w and h in meters. For measured Ω, R is the arithmetic mean. Full batch current through one path is a conservative screening assumption, not an actual current map.
Metal density is the dense bulk value. Gold assumes Au(I); Au(III) and alloy baths require different constants. Efficiency defaults (Cu 98%, Ni 95.5%, Ag 95%, Zn 90%, Au 95%) are editable estimates, not universal bath data. Single-metal DC only: no alloy composition, pulse waveform, stress, porosity or throwing-power model.
Charge Q = m n F / (M η). Starting current Iₛ = I × start share; starting seconds tₛ = min(selected start seconds, Q / Iₛ). Total seconds = tₛ + max(0, Q − Iₛtₛ) / I. The same efficiency is assumed in both stages. Growth rate shown is the later run stage. Rack allowance adds area, estimated deposit and charge.
A practical checklist for setup, the run, and the finish. Follow the instructions for your exact chemistry first.
Use constant-current mode: calculate amps from the total exposed area. Voltage is what the supply needs to drive that current; there is no universal plating voltage.
Start within the supplier’s range. Painted surfaces often need a gentler start while metal connects the surface. Sharp edges attract current; recesses lag. Add good contacts and consider repositioning or shielding under the bath instructions.
Look for rough, dark or powdery edges, nodules or branching growth. Reduce current and check circulation, contact and bath condition. More time won’t repair a defective layer.
*Stylized texture illustrations, not diagnostic photographs. Appearance varies by metal and chemistry.Full color coverage is the start of a continuous film, not proof of thickness. Track amp-hours and verify with an appropriate thickness method or a representative test coupon. Check recesses as well as exposed edges.
For an average check on a clean, dry sample: δ ≈ added mass / (density × area). Account for deposit on the hanger. Rinse and dry by the supplier’s procedure before evaluating.
At a fixed A/dm², doubling the area doubles the amps, while ideal time stays the same. At a fixed amp limit, doubling area approximately doubles time. Doubling target thickness doubles charge.
A batch total doesn’t mean each part gets equal current. Position, contacts and geometry matter. The 3D viewer shows shape only; it does not simulate current distribution.
Quick answers about amps, voltage, plating time and getting started.
Multiply exposed conductive area in dm² by your bath supplier’s current density in A/dm²: I = J × A. For example, 100 cm² is 1 dm², so 1 A/dm² requires 1 A. Count every wetted conductive face and any exposed hanging wire.
There is no single voltage for every part and bath. Set current within your supplier’s specified range; the supply needs enough voltage to maintain it. This calculator estimates resistive voltage loss through a conductive coating from measured resistance or conductivity. It does not calculate total bath voltage or prescribe a safe voltage setting.
Time depends on target thickness, delivered current, exposed area, deposit metal and cathode efficiency. At the same current density, a larger part needs more amps but approximately the same ideal plating time. Once the power supply reaches its current limit, increasing exposed area increases the estimated time. Preparation, rinsing and finishing take additional time.
Yes. Upload one or more STEP/STP, STL, OBJ or 3MF files to preview the geometry and estimate surface area. STEP and 3MF use embedded measurements; confirm the units for STL and OBJ. Adjust exposed fractions for masked or sealed surfaces. Files are processed locally in your browser.
You need a suitably prepared print with a compatible continuous conductive layer, an appropriate copper bath and anode, reliable contacts and a suitable DC supply, plus the protection and ventilation required by the chemistry. PrintPlating offers starter kits, a kit with a power supply and conductive paint. Check the product pages for contents and required extras before buying.
Yes. PrintPlating provides this calculator free to use without an account or purchase. It is a planning estimate, not a validated process setting or a guarantee of thickness, adhesion or finish. Verify your inputs against supplier instructions and a test coupon.